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Optomec Aerosol Jet FLEX

ENABLING A NEW GENERATION IN ADVANCED PACKAGING & ASSEMBLY

The Aerosol Jet HD Series of in-line digital dispense systems, with its compact design and seamless fit in today’s production lines, brings digital dispensing to a whole new level. The Aerosol Jet HD System is a compact, configurable production platform that can dispense a wide range of electronics materials with features as small as 20 microns. The system can also produce larger features, from 100’s of microns to millimeters, and print wide-area conformal coatings from 100 nanometers to 10’s of microns in thickness.

Description

The Aerosol Jet FLEX system is a scalable platform capable of addressing a wide array of 2, 2.5, and 3D printed applications requirements. The system comes equipped with an Optomec closely coupled print module ideally suited for high resolution printing of electronic circuits and devices for rapid prototyping, product development and printed material evaluation. The Aerosol Jet FLEX system comes with 3-axis of coordinated print motion as standard with the option to upgrade to the 5X platform functionality.  Optional add-ons include wide feature printheads; 1W, 830nm IR Laser; 340nm UV Cure solution; and a tilt & rotate trunnion making the system full 5-axis of coordinated motion capable.

 

Standard Features

  • Work area 350mm x 250mm x 200mm (x, y, z)
  • Motion Repeatability Accuracy +/-2 Microns
  • Interchangeable Closely Coupled Atomizers
  • Fine Feature Deposition Printhead with Integrated Divert Shutter
  • System and Process Control Software
  • Tool Path Generation Software
  • Stainless Steel Cabinet with Granite Table Top
  • CE

Optional Features

  • UV Cure Module
  • 1W, 830nm IR Laser
  • Interchangeable Wide Feature Deposition Printheads
  • Trunnion with 200mm x 300mm x 200mm work area (enables coordinated 5-axis of coordinated motion)

Applications

Advanced development platform specifically geared for printing electronics onto 2D and 2.5D surfaces. Ideally suited for process development, rapid prototyping and low volume production. Example applications include:

  • 3D Die and Chip Interconnects
  • Die and Component Attach
  • RF/EMI Shielding
  • Precision Underfill
  • Printed Sensors and Circuits for the Internet of Things
  • Low Volume Manufacturing

Print Capabilities

  • Fine Feature Sizes as small as 10 microns
  • Support for wide range of printable materials and substrates
  • Ink Viscosity Range from 1 to 1000 cP
  • Optional Wide Feature Print Head supporting mm size features
  • In-situ Material Curing
  • Low Temperature Processing