Description
PERFORMANCE
THEIA delivers ultra fast deposition with Forge Nano’s patented SMFD-ALD™ in a low cost system for R&D budgets. Sub-second ALD cycle times allow efficient and rapid exploration of applications requiring thick films. Covering challenging patterned substrates such as advanced-generation DRAM device wafers, membranes, sensors, electron multipliers, etc. with aspect ratios up to 1,000. THEIA is a low-cost and versatile ALD system that fits most R&D budgets. The flexible chamber design allows for both; round up to 200 mm substrate chuck that fits semiconductor wafers, or square parts carrying tray that better accommodates panels or randomly shaped parts.
CAPABILITIES
- Fast and thick film deposition ( > 5 micron)
- Fast ALD deposition at low temperatures
- Low temperature processing (down to 80 °C)
- Seamless incorporation of nano-laminates with reproducible atomic-layer control
- Composite ternary and quaternary alloy films with no throughput penalty
- In situ QCM monitoring of film growth with high mass and time resolution
- Field reconfigurable
SPECIFICATIONS
- Temperature Window: 50 – 500 °C
- Liquid Chemical Inlets: Up to 6
- Gaseous Chemical Inlets: Up to 4
- Footprint: 60″ L x 32″ W x 76″ H
- Capacity: Up to 200mm wafers
- 5mm height clearance for coupons and objects
- Substrate Handling: Manual single wafer loading
ULTRA FAST DEPOSITION WITH FORGE NANO’S PATENTED SMFD-ALD™
Chemistries: Al2O3, SiO2, AZO, TiO2, GaN, TiN, Bi2O3, Pt, Co, Cu, Ta205, Hf203, MLD
THEIA is ideal for exploration of newly developed ALD precursors. At the initial stage, ALD precursors are often extremely expensive ($1,000/gm is not unusual) and are available in very small quantities. Users also benefit from the many mature high productivity ALD processes that include HfO2, ZrO2, Ta2O5 SiO2, <300°C TiN, BN, GaN, Nb3N5 and more, available as turn-key processes from Forge Nano. Covering challenging patterned substrates such as advanced-generation DRAM device wafers, membranes, sensors, electron multipliers, etc. with up to 1,000 X enhanced area.
Applications: Copper Barrier, ALD-Cap, Optical, Adhesion/Seeding, TCOs
Find out more on the ForgeNano website
